Reduced models for linearly elastic thin films allowing for fracture, debonding or delamination
نویسندگان
چکیده
This work is devoted so show the appearance of different cracking modes in linearly elastic thin film systems by means of an asymptotic analysis as the thickness tends to zero. By superposing two thin plates, and upon suitable scaling law assumptions on the elasticity and fracture parameters, it is proven that either debonding or transverse cracks can emerge in the limit. A model coupling debonding, transverse cracks and delamination is also discussed.
منابع مشابه
Influence of Interfacial Delamination on Channel Cracking of Elastic Thin Films
Channeling cracks in brittle thin films have been observed to be a key reliability issue for advanced interconnects and other integrated structures. Most theoretical studies to date have assumed no delamination at the interface, while experiments have observed channel cracks both with and without interfacial delamination. This paper analyzes the effect of interfacial delamination on the fractur...
متن کاملNonlinear Delamination Mechanics for Thin Films
Delamination of prestressed thin films on thick substrates is analysed accounting for plastic dissipation in either the substrate or film. Emphasis is on large scale yielding wherein the height of the plastic zone at the propagating interface crack tip is comparable to the film thickness. Such conditions are common for both metal and polymer thin films on elastic substrates or for ceramic coati...
متن کاملInfluence of Interfacial Delamination on Channel Cracking of Brittle Thin Films
Channeling cracks in low-k dielectrics have been observed to be a key reliability issue for advanced interconnects. The constraint effect of surrounding materials including stacked buffer layers has been studied. This paper analyzes the effect of interfacial delamination on the fracture condition of brittle thin films on elastic substrates. It is found that stable delamination along with the gr...
متن کاملStress and Moisture Effects on Thin Film Buckling Delamination
Deposition processes control the properties of thin films; they can also introduce high residual stresses, which can be relieved by delamination and fracture. Tungsten films with high 1–2 GPa compressive residual stresses were sputter deposited on top of thin (below 100 nm) copper and diamond-like carbon (DLC) films. Highly stressed films store large amounts of strain energy. When the strain en...
متن کاملThe macroscopic delamination of thin films from elastic substrates.
The wrinkling and delamination of stiff thin films adhered to a polymer substrate have important applications in "flexible electronics." The resulting periodic structures, when used for circuitry, have remarkable mechanical properties because stretching or twisting of the substrate is mostly accommodated through bending of the film, which minimizes fatigue or fracture. To date, applications in ...
متن کامل